Integrated circuit package with printed circuit layer

Invention Grant

US09111845B2 Integrated circuit package with printed circuit layer 有权

Title translation: 具印刷电路层的集成电路封装

Patent Title: Integrated circuit package with printed circuit layer
Patent Title (中): 具印刷电路层的集成电路封装
Application No.: US14468370

Application Date: 2014-08-26
Publication No.: US09111845B2

Publication Date: 2015-08-18
Inventor: Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
Applicant: Texas Instruments Incorporated
Applicant Address: US TX Dallas
Assignee: TEXAS INSTRUMENTS INCORPORATED
Current Assignee: TEXAS INSTRUMENTS INCORPORATED
Current Assignee Address: US TX Dallas
Agent Steven A. Shaw; Frank D. Cimino
Main IPC: H01L29/00
IPC: H01L29/00 ; H01L23/00 ; H01L49/02 ; H01L23/28 ; H01L23/522 ; H05K1/16

Abstract:

An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract(Chinese):

一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。

Public/Granted literature

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）