Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13954718Application Date: 2013-07-30
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Publication No.: US09112016B2Publication Date: 2015-08-18
- Inventor: Tsubasa Yamada
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2010-250536 20101109
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/10

Abstract:
According to one embodiment, a semiconductor device, including a semiconductor layer including a first region and a second region isolated from the first region, a source in a surface of the first region, a drain in a surface of the second region, a back-gate in the surface of the source, a gate insulator on a surface of the first region, an end of a drain side of the back-gate being located closer to the drain side than an end of the drain side of the source, a gate insulator on a surface of the semiconductor layer between the first region and the second region, a gate electrode on the gate insulator, a source electrode being contacted to both the source and the back-gate, and a drain electrode being contacted to the drain area.
Public/Granted literature
- US20140035031A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-02-06
Information query
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