Invention Grant
- Patent Title: Semiconductor chip, display comprising a plurality of semiconductor chips and methods for the production thereof
- Patent Title (中): 半导体芯片,包括多个半导体芯片的显示器及其制造方法
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Application No.: US14008638Application Date: 2012-01-30
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Publication No.: US09112089B2Publication Date: 2015-08-18
- Inventor: Norwin von Malm , Alexander Linkov , Norbert Linder
- Applicant: Norwin von Malm , Alexander Linkov , Norbert Linder
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102011015726 20110331
- International Application: PCT/EP2012/051446 WO 20120130
- International Announcement: WO2012/130499 WO 20121004
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/10 ; H01L27/15 ; H01L33/46 ; H01L33/32 ; H01L33/40 ; H01L33/50 ; H01L33/58

Abstract:
An optoelectronic semiconductor chip including a semiconductor body of semiconductor material, an outcoupling face arranged downstream of the semiconductor body in an emission direction and a mirror layer, wherein the semiconductor body includes an active layer that generates radiation, the mirror layer is arranged on the side of the semiconductor body remote from the outcoupling face, and a gap between the active layer and the mirror layer is set such that radiation emitted by the active layer towards the outcoupling face interferes with radiation reflected at the mirror layer such that the semiconductor chip features an emitted radiation pattern with a selected direction in the forward direction.
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