Invention Grant
- Patent Title: Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
- Patent Title (中): 半导体发光器件及半导体发光器件的制造方法
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Application No.: US14093925Application Date: 2013-12-02
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Publication No.: US09112111B2Publication Date: 2015-08-18
- Inventor: Hajime Nago , Yoshiyuki Harada , Shigeya Kimura , Hisashi Yoshida , Shinya Nunoue
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-286131 20121227
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01L33/32 ; H01S5/32 ; H01S5/30 ; H01L33/00 ; H01L33/02

Abstract:
According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer. The p-type semiconductor layer includes a first p-side layer, a second p-side layer, and a third p-side layer. A concentration profile of Mg of a p-side region includes a first portion, a second portion, a third portion, a fourth portion, a fifth portion, a sixth portion and a seventh portion. The p-side region includes the light emitting layer, the second p-side layer, and the third p-side layer. A Mg concentration of the sixth portion is not less than 1×1020 cm−3 and not more than 3×1020 cm−3. The Al concentration is 1/100 of the maximum value at a second position. A Mg concentration at the second position is not less than 2×1018 cm−3.
Public/Granted literature
- US20140183446A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2014-07-03
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