Invention Grant
- Patent Title: Light emitting diode package and light unit having the same
- Patent Title (中): 发光二极管封装和具有相同光源的单元
-
Application No.: US13006687Application Date: 2011-01-14
-
Publication No.: US09112129B2Publication Date: 2015-08-18
- Inventor: Joong In An
- Applicant: Joong In An
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2010-0004410 20100118
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/64 ; H01L33/62

Abstract:
Disclosed are a light emitting device package and a light unit having the same. The light emitting device package includes a body including a cavity at a first side surface, first and second lead frames in the cavity, a light emitting device connected to the first and second lead frames, a heat radiation pad on a second side surface of the body, a heat radiation frame on a third side surface of the body, and first and second electrode pads disposed on the second side surface of the body and spaced apart from the heat radiation pad.
Public/Granted literature
- US20110198658A1 LIGHT EMITTING DIODE PACKAGE AND LIGHT UNIT HAVING THE SAME Public/Granted day:2011-08-18
Information query
IPC分类: