A method for producing an optoelectronic component may include forming a first electrode on a substrate, forming an organic functional layer structure on the first electrode; forming a second electrode on the organic functional layer structure, forming at least one contact for making contact with the first and/or second electrode, forming an encapsulation layer above the layer structure and the contact, removing the encapsulation layer above the contact with the aid of an anisotropic etching method, and cooling the substrate during the anisotropic etching method.