Invention Grant
- Patent Title: Microwave resonant cavity
- Patent Title (中): 微波谐振腔
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Application No.: US13966930Application Date: 2013-08-14
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Publication No.: US09112251B2Publication Date: 2015-08-18
- Inventor: Wen Chi Fu
- Applicant: MICROELECTRONICS TECHNOLOGY, INC.
- Applicant Address: TW Hsinchu
- Assignee: Microelectronics Technology, Inc.
- Current Assignee: Microelectronics Technology, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: H01P7/06
- IPC: H01P7/06 ; H01P1/207

Abstract:
A microwave resonant cavity includes a conductive shell with a screw hole having first threads and a screw having second threads configured to engage with the screw hole. The conductive shell defines a volume, the screw extends into the volume, the microwave resonant cavity has a resonant frequency, and the movement of the screw changes the resonant frequency. The first threads have a first pitch, and at least a portion of the second threads has a second pitch different from the first pitch.
Public/Granted literature
- US20150048905A1 MICROWAVE RESONANT CAVITY Public/Granted day:2015-02-19
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