Invention Grant
- Patent Title: Terminal-equipped wire
- Patent Title (中): 终端配线
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Application No.: US13388092Application Date: 2010-08-25
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Publication No.: US09112290B2Publication Date: 2015-08-18
- Inventor: Kouichiro Matsushita
- Applicant: Kouichiro Matsushita
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-194254 20090825
- International Application: PCT/JP2010/064850 WO 20100825
- International Announcement: WO2011/025046 WO 20110303
- Main IPC: H02G15/02
- IPC: H02G15/02 ; H01R4/62 ; H01R4/18

Abstract:
A terminal-equipped wire includes a wire and a terminal. The wire includes a core wire and an insulative sheath covering a part of the core wire. The core wire has a plurality of conductive element wires. The terminal includes a wire connection portion connected to the core wire at an end part of the wire where the core wire is exposed. Outer surfaces of the element wires and the wire connection portion are tinned.
Public/Granted literature
- US20120125684A1 TERMINAL-EQUIPPED WIRE Public/Granted day:2012-05-24
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