Invention Grant
- Patent Title: EBG structure and circuit board
- Patent Title (中): EBG结构和电路板
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Application No.: US13951875Application Date: 2013-07-26
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Publication No.: US09112475B2Publication Date: 2015-08-18
- Inventor: Tadahiro Sasaki , Kazuhiko Itaya , Hiroshi Yamada
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-167661 20120727
- Main IPC: H04B3/28
- IPC: H04B3/28 ; H03H7/01 ; H05K1/02

Abstract:
An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer that is provided on the patch unit; a first via that is provided between the patch unit in the first insulating layer and the electrode and connected to the patch unit and the electrode; and a second via that is provided in the first and second insulating layers, the second via piercing the first gap and being connected to the electrode.
Public/Granted literature
- US20140028412A1 EBG STRUCTURE AND CIRCUIT BOARD Public/Granted day:2014-01-30
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