Invention Grant
US09113533B2 Semiconductor package with incorporated light or temperature sensors and time multiplexing
有权
具有并入的光或温度传感器和时间复用的半导体封装
- Patent Title: Semiconductor package with incorporated light or temperature sensors and time multiplexing
- Patent Title (中): 具有并入的光或温度传感器和时间复用的半导体封装
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Application No.: US12864525Application Date: 2009-01-23
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Publication No.: US09113533B2Publication Date: 2015-08-18
- Inventor: Jeffrey Dellert Kmetec , Frans Maurits Vos
- Applicant: Jeffrey Dellert Kmetec , Frans Maurits Vos
- Applicant Address: NL Eindhoven
- Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee Address: NL Eindhoven
- Agent Yuliya Mathis
- Priority: EP08150811 20080130
- International Application: PCT/IB2009/050273 WO 20090123
- International Announcement: WO2009/095829 WO 20090806
- Main IPC: H05B37/02
- IPC: H05B37/02 ; H05B33/08

Abstract:
Proposed is a package (10) having at least two pins (11, 12). The package comprises a semiconductor structure (20) having a first function and an electrical circuit (30) comprising at least one circuit element having a second function. The structure (20) and the circuit (30) are electrically connected to the pins (11, 12). Moreover, the package is operable to perform the first and second function by time multiplexing a first (60) and second (70) operating signal through the pins (11, 12). Finally, the first function is a lighting function and the second function is a sensing function. The invention is especially advantageous as it provides a cost effective and versatile miniaturized light emitting package comprising LEDs or laser diodes.
Public/Granted literature
- US20120248988A1 SEMICONDUCTOR PACKAGE WITH INCORPORATED LIGHT OR TEMPERATURE SENSORS AND TIME MULTIPLEXING Public/Granted day:2012-10-04
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