Invention Grant
US09113533B2 Semiconductor package with incorporated light or temperature sensors and time multiplexing 有权
具有并入的光或温度传感器和时间复用的半导体封装

Semiconductor package with incorporated light or temperature sensors and time multiplexing
Abstract:
Proposed is a package (10) having at least two pins (11, 12). The package comprises a semiconductor structure (20) having a first function and an electrical circuit (30) comprising at least one circuit element having a second function. The structure (20) and the circuit (30) are electrically connected to the pins (11, 12). Moreover, the package is operable to perform the first and second function by time multiplexing a first (60) and second (70) operating signal through the pins (11, 12). Finally, the first function is a lighting function and the second function is a sensing function. The invention is especially advantageous as it provides a cost effective and versatile miniaturized light emitting package comprising LEDs or laser diodes.
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