Invention Grant
- Patent Title: Tape wiring substrate and chip-on-film package including the same
- Patent Title (中): 带状布线基板和包括其的片上胶片封装
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Application No.: US13604412Application Date: 2012-09-05
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Publication No.: US09113545B2Publication Date: 2015-08-18
- Inventor: Sang-uk Han , Young-shin Kwon , Kwan-jai Lee , Jae-min Jung , Kyong-soon Cho , Jeong-kyu Ha
- Applicant: Sang-uk Han , Young-shin Kwon , Kwan-jai Lee , Jae-min Jung , Kyong-soon Cho , Jeong-kyu Ha
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2011-0138490 20111220
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K7/00 ; H05K1/02 ; H05K3/32 ; H05K1/14 ; H05K1/18
Abstract:
A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.
Public/Granted literature
- US20130148312A1 TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME Public/Granted day:2013-06-13
Information query
