Systems, methods and articles of manufacture for rigid flex circuit boards are described herein. Embodiments of the present disclosure relate to equipping a rigid flex circuit board with a first rigid substrate, a second rigid substrate that includes an asymmetric region where the first rigid substrate is not extended over the asymmetric region of the second rigid substrate. The rigid flex circuit board also includes a flexible substrate between the first rigid substrate and the second rigid substrate. A second portion of the flexible substrate protrudes from the non-overlap region where the second portion of the flexible substrate is not adhered to the second rigid substrate in the non-overlap region. The second portion of the flexible substrate is configured to be accessible from the asymmetric region of the rigid flex circuit board.