Invention Grant
- Patent Title: Printed circuit board assembly
- Patent Title (中): 印刷电路板组装
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Application No.: US13982036Application Date: 2012-01-30
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Publication No.: US09113584B2Publication Date: 2015-08-18
- Inventor: Hangfeng Ji , Abraham Rudolf Balkenende , Hong Chen
- Applicant: Hangfeng Ji , Abraham Rudolf Balkenende , Hong Chen
- Applicant Address: NL Eindhoven
- Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee Address: NL Eindhoven
- Agent Yuliya Mathis
- Priority: WOPCT/CN2011/070824 20110130
- International Application: PCT/IB2012/050408 WO 20120130
- International Announcement: WO2012/101611 WO 20120802
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K3/30 ; H05K3/22 ; H05K1/02 ; H05K3/32 ; H05K3/34
Abstract:
The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.
Public/Granted literature
- US20130314885A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2013-11-28
Information query
