Invention Grant
- Patent Title: Interconnection of semiconductor device with graphene wire
- Patent Title (中): 半导体器件与石墨烯线的互连
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Application No.: US13966164Application Date: 2013-08-13
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Publication No.: US09117738B2Publication Date: 2015-08-25
- Inventor: Makoto Wada , Hisao Miyazaki , Akihiro Kajita , Atsunobu Isobayashi , Tatsuro Saito , Tadashi Sakai
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2013-027925 20130215
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/768 ; H01L21/3215 ; H01L23/532 ; H01L27/105

Abstract:
According to one embodiment, a semiconductor device using multi-layered graphene wires includes a substrate having semiconductor elements formed therein, a first graphene wire formed above the substrate and including a multi-layered graphene layer having a preset impurity doped therein, a second graphene wire formed on the same layer as the first multi-layered graphene wire above the substrate and including a multi-layered graphene layer into which the preset impurity is not doped, a lower-layer contact connected to the undersurface side of the first multi-layered graphene wire, and an upper-layer contact connected to the upper surface side of the second multi-layered graphene wire.
Public/Granted literature
- US20140231751A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-08-21
Information query
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