Invention Grant
- Patent Title: Bonding package components through plating
- Patent Title (中): 通过电镀将封装组件接合
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Application No.: US13527422Application Date: 2012-06-19
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Publication No.: US09117772B2Publication Date: 2015-08-25
- Inventor: Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- Applicant: Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/31 ; H01L25/10 ; H01L25/00 ; H01L25/065 ; H01L21/56 ; H01L23/498 ; H01L23/00
Abstract:
A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
Public/Granted literature
- US20130334692A1 Bonding Package components Through Plating Public/Granted day:2013-12-19
Information query
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