Invention Grant
- Patent Title: Air cavity packages having high thermal conductivity base plates and methods of making
- Patent Title (中): 具有高导热性基板的空气腔封装和制造方法
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Application No.: US13930101Application Date: 2013-06-28
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Publication No.: US09117793B2Publication Date: 2015-08-25
- Inventor: George Michael Wityak , Richard Koba
- Applicant: Materion Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: Materion Corporation
- Current Assignee: Materion Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/043 ; H01L23/373 ; H01L23/34 ; H01L23/495
Abstract:
A high thermal conductivity base plate is provided for use in air cavity packages. The base plate is at least partially comprised of a composite made of silver-diamond or a silver alloy-diamond. In some embodiments, the base plate is entirely comprised of the composite. In other embodiments, the base plate has a core made of the composite. The core can include at least one outer layer on the core. The semiconductor package can include one or more dice or transistors on the base plate, an insulated frame on the base plate, and one or more leads on the insulated frame.
Public/Granted literature
- US20140001628A1 AIR CAVITY PACKAGES HAVING HIGH THERMAL CONDUCTIVITY BASE PLATES AND METHODS OF MAKING Public/Granted day:2014-01-02
Information query
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