Invention Grant
- Patent Title: Embedded on-chip security
- Patent Title (中): 嵌入式片上安全性
-
Application No.: US14032218Application Date: 2013-09-20
-
Publication No.: US09117824B2Publication Date: 2015-08-25
- Inventor: Kai D. Feng , Wai-Kin Li , Ping-Chuan Wang , Zhijian Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly; Catherine Ivers
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/535 ; H01L21/768 ; H01L23/00

Abstract:
Embodiments of the invention include a semiconductor structure containing a back end of line randomly patterned interconnect structure for implementing a physical unclonable function (PUF), a method for forming the semiconductor device, and a circuit for enabling the interconnect structure to implement the physical unclonable function. The method includes forming a semiconductor substrate and a dielectric layer on the substrate. The randomly patterned interconnect structure is formed in the dielectric layer. The random pattern of the interconnect structure is used to implement the physical unclonable function and is a result of defect occurrences during the manufacturing of the semiconductor structure. The circuit includes n-channel and p-channel metal oxide semiconductor field effect transistors (MOSFETs) and the randomly patterned interconnect structure, which acts as electrical connections between the MOSFETs. The random electrical connections between MOSFETs are utilized for generation of unique keys for purposes such as authentication or identification.
Public/Granted literature
- US20150084193A1 EMBEDDED ON-CHIP SECURITY Public/Granted day:2015-03-26
Information query
IPC分类: