Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and method of manufacturing the same
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US13752526Application Date: 2013-01-29
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Publication No.: US09117848B2Publication Date: 2015-08-25
- Inventor: Haruka Kusai , Kiwamu Sakuma , Masao Shingu , Shosuke Fujii , Masahiro Kiyotoshi
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-022111 20120203
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/66 ; H01L29/788 ; H01L27/115

Abstract:
According to one embodiment, a nonvolatile semiconductor memory device includes a fin structure stacked in order of a first oxide layer, a semiconductor layer and a second oxide layer in a first direction perpendicular to a surface of the semiconductor substrate, the fin structure extending in a second direction parallel to the surface of the semiconductor substrate, and a gate structure stacked in order of a gate oxide layer, a charge storage layer, a block insulating layer and a control gate electrode in a third direction perpendicular to the first and second directions from a surface of the semiconductor layer in the third direction.
Public/Granted literature
- US20130200450A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-08-08
Information query
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