Invention Grant
- Patent Title: Semiconductor device comprising a graphene wire
- Patent Title (中): 包括石墨烯线的半导体器件
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Application No.: US13846850Application Date: 2013-03-18
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Publication No.: US09117851B2Publication Date: 2015-08-25
- Inventor: Makoto Wada , Yuichi Yamazaki , Akihiro Kajita , Atsunobu Isobayashi , Tatsuro Saito
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2012-208669 20120921
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; B82Y30/00 ; H01L23/532 ; C01B31/04

Abstract:
According to one embodiment, a semiconductor device includes a catalyst underlying layer formed on a substrate including semiconductor elements formed thereon and processed in a wiring pattern, a catalyst metal layer that is formed on the catalyst underlying layer and whose width is narrower than that of the catalyst underlying layer, and a graphene layer growing with a sidewall of the catalyst metal layer set as a growth origin and formed to surround the catalyst metal layer.
Public/Granted literature
- US20140084250A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-03-27
Information query
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