Invention Grant
- Patent Title: Laser processing method
- Patent Title (中): 激光加工方法
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Application No.: US14154706Application Date: 2014-01-14
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Publication No.: US09117895B2Publication Date: 2015-08-25
- Inventor: Hiroshi Morikazu , Noboru Takeda
- Applicant: Disco Corporation
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, LTD
- Priority: JP2013-012209 20130125
- Main IPC: H01L21/78
- IPC: H01L21/78

Abstract:
A laser processing method for performing laser processing to a workpiece. The laser processing method includes: a filament forming step of applying a first pulsed laser beam having a transmission wavelength to the workpiece to thereby form a filament as an optical transmission line in the workpiece so that the filament extends from the surface of the workpiece to be irradiated with the first pulsed laser beam to the inside of the workpiece, the filament having a refractive index higher than that of the workpiece; and a laser processing step of applying a second pulsed laser beam to the filament after performing the filament forming step to thereby transmit the second pulsed laser beam along the filament, thereby processing the workpiece with the second pulsed laser beam.
Public/Granted literature
- US20140213040A1 LASER PROCESSING METHOD Public/Granted day:2014-07-31
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