Invention Grant
- Patent Title: Piezoelectric vibration module
- Patent Title (中): 压电振动模块
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Application No.: US13536332Application Date: 2012-06-28
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Publication No.: US09117999B2Publication Date: 2015-08-25
- Inventor: Jae Kyung Kim , Dong Sun Park , Yeon Ho Son
- Applicant: Jae Kyung Kim , Dong Sun Park , Yeon Ho Son
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2011-0064704 20110630
- Main IPC: H01L41/053
- IPC: H01L41/053 ; H01L41/09 ; H03H9/17 ; G06F3/01

Abstract:
Disclosed herein is a piezoelectric vibration module including: a piezoelectric element repeatedly extended and compressed according to application of external power to generate vibration force; a vibration plate having the piezoelectric element coupled to one surface thereof and repeatedly extended and compressed integrally with the piezoelectric element to transfer the vibration force of the piezoelectric element to an external component; a weight body having a central portion coupled to the other side of the vibration plate in order to increase the vibration force of the piezoelectric element; and a coupling member fixedly coupling the central portion of the weight body and the vibration plate to each other.
Public/Granted literature
- US20130002093A1 PIEZOELECTRIC VIBRATION MODULE Public/Granted day:2013-01-03
Information query
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