Invention Grant
- Patent Title: Circuit board and circuit module
- Patent Title (中): 电路板和电路模块
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Application No.: US14557609Application Date: 2014-12-02
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Publication No.: US09118105B2Publication Date: 2015-08-25
- Inventor: Noboru Kato , Jun Sasaki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-117391 20090514; JP2009-190897 20090820
- Main IPC: H01Q7/08
- IPC: H01Q7/08 ; H01Q7/06 ; H01L23/538 ; H01L23/66 ; H01Q1/20 ; H01Q7/00 ; H05K1/02 ; H05K1/16 ; H05K1/18 ; H05K3/46
Abstract:
A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.
Public/Granted literature
- US20150084822A1 CIRCUIT BOARD AND CIRCUIT MODULE Public/Granted day:2015-03-26
Information query
