Invention Grant
- Patent Title: Resilient mounting assembly for photovoltaic modules
- Patent Title (中): 用于光伏组件的弹性安装组件
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Application No.: US13551003Application Date: 2012-07-17
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Publication No.: US09118273B2Publication Date: 2015-08-25
- Inventor: Anthony Charles Martin , Martin Fornage , Ho Gene Choi
- Applicant: Anthony Charles Martin , Martin Fornage , Ho Gene Choi
- Applicant Address: US CA Petaluma
- Assignee: Enphase Energy, Inc.
- Current Assignee: Enphase Energy, Inc.
- Current Assignee Address: US CA Petaluma
- Agency: Moser Taboada
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H02S40/32 ; H01L31/04
Abstract:
An apparatus for mounting a power module. In one embodiment, the apparatus comprises a plurality of mounting points that (i) are flexibly connected to one another and (ii) flexibly mount the power module proximate a photovoltaic (PV) module.
Public/Granted literature
- US20130021730A1 RESILIENT MOUNTING ASSEMBLY FOR PHOTOVOLTAIC MODULES Public/Granted day:2013-01-24
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