Invention Grant
- Patent Title: Chip comprising a radio frequency switch arrangement, circuit arrangement and method for producing a radio frequency circuit arrangement
- Patent Title (中): 芯片包括射频开关装置,用于产生射频电路装置的电路装置和方法
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Application No.: US13228078Application Date: 2011-09-08
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Publication No.: US09118395B2Publication Date: 2015-08-25
- Inventor: Winfried Bakalski
- Applicant: Winfried Bakalski
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102010040512 20100909
- Main IPC: H01P1/10
- IPC: H01P1/10 ; H04B1/44 ; H04B1/00 ; H03K17/00

Abstract:
A chip includes an RF switch arrangement that has a plurality of RF switches arranged jointly on the chip. Each of the RF switches has at least one first RF connection accessible from outside the chip and one second RF connection accessible from outside the chip. Furthermore, each of the RF switches is designed to activate, in response to a driving, at least one RF path between two of its RF connections. The RF connections of different switches from among the RF switches are separated from one another in terms of radio frequency.
Public/Granted literature
Information query