A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.