Invention Grant
- Patent Title: Cover
- Patent Title (中): 盖
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Application No.: US14227946Application Date: 2014-03-27
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Publication No.: US09119308B2Publication Date: 2015-08-25
- Inventor: Hui-Ping Juan
- Applicant: INVENTEC (PUDONG) TECHNOLOGY CORPORATION , INVENTEC CORPORATION
- Applicant Address: CN Shanghai TW Taipei
- Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee Address: CN Shanghai TW Taipei
- Agency: Huffman Law Group, PC
- Priority: CN201310597466 20131122
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; B65D5/52 ; B65D25/24 ; H05K5/03 ; H05K5/02

Abstract:
A cover for an electronic device includes a bottom plate, a first support plate, a top plate, two bending plates and a rubber trim. The bottom plate has a first end and a second end that are opposite to each other. The first support plate is connected to the first end of the bottom plate. The top plate is connected to the second end of the bottom plate, for expanding or closing relative to the bottom plate, and the top plate having a through hole. The two bending plates are opposite to each other and connect the bottom plate and the top plate. The two bending plates, the bottom plate and the top plate form an accommodating space. The rubber trim is disposed on the first support plate. When the top plate closes relative to the bottom plate, the top plate pass through and protrudes from the through hole.
Public/Granted literature
- US20150146370A1 COVER Public/Granted day:2015-05-28
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