Invention Grant
- Patent Title: System in package assembly
- Patent Title (中): 系统在包装组装
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Application No.: US13783722Application Date: 2013-03-04
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Publication No.: US09119320B2Publication Date: 2015-08-25
- Inventor: Li-Cheng Shen
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Guishan Dist., Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Guishan Dist., Taoyuan
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW101131121A 20120413
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K13/00 ; H01L23/13 ; H01L25/16 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H05K1/11 ; H05K3/34
Abstract:
A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board.
Public/Granted literature
- US20130271924A1 SYSTEM IN PACKAGE ASSEMBLY Public/Granted day:2013-10-17
Information query
