Invention Grant
- Patent Title: Bonding structure manufacturing method, heating and melting treatment method, and system therefor
- Patent Title (中): 粘结结构制造方法，加热熔融处理方法及其系统
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Application No.: US14275153Application Date: 2014-05-12
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Publication No.: US09119336B2Publication Date: 2015-08-25
- Inventor: Hideyuki Abe , Kazuaki Mawatari
- Applicant: Hideyuki Abe , Kazuaki Mawatari
- Applicant Address: JP Himeji-Shi, Hyogo
- Assignee: AYUMI INDUSTRY CO., LTD.
- Current Assignee: AYUMI INDUSTRY CO., LTD.
- Current Assignee Address: JP Himeji-Shi, Hyogo
- Agency: Porzio, Bromberg & Newman, P.C.
- Priority: JP2010-146337 20100628; JP2010-166448 20100723
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H05K13/04 ; B23K1/20 ; B23K1/00 ; B23K1/008 ; H01L23/00
Abstract:
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
Public/Granted literature
- US20140246481A1 BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM THEREFOR Public/Granted day:2014-09-04
Information query
IPC分类:
