Invention Grant
- Patent Title: Electronic housing and sensor connection arrangement
- Patent Title (中): 电子外壳和传感器连接装置
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Application No.: US13629207Application Date: 2012-09-27
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Publication No.: US09119594B2Publication Date: 2015-09-01
- Inventor: Mark A. Oleson , Samuel J. Hollenbach , F. Grant Kovach , Jason Berns
- Applicant: Mark A. Oleson , Samuel J. Hollenbach , F. Grant Kovach , Jason Berns
- Applicant Address: US MD Baltimore
- Assignee: Under Armour, Inc.
- Current Assignee: Under Armour, Inc.
- Current Assignee Address: US MD Baltimore
- Agency: Maginot, Moore & Beck LLP
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A41B1/08 ; A41B9/06

Abstract:
A garment includes a fabric portion, an electrode fixedly connected to the fabric portion, a receptacle fixedly connected to the fabric portion, and an electronics module releasably positioned in the receptacle. The receptacle includes a receptacle housing, an electrode lead, and a receptacle contact. The electrode lead is attached to the electrode. The electrode lead engages the receptacle contact to establish an electrical connection with the receptacle contact without being attached to the receptacle contact. The electronics module includes a module contact that engages the receptacle contact when the electronics module is positioned in the socket to establish an electrical connection between the module contact and the receptacle contact.
Public/Granted literature
- US20130077263A1 Electronic Housing and Sensor Connection Arrangement Public/Granted day:2013-03-28
Information query