Invention Grant
- Patent Title: Laser processing machine and laser processing method
- Patent Title (中): 激光加工机和激光加工方法
-
Application No.: US13878579Application Date: 2011-10-21
-
Publication No.: US09120176B2Publication Date: 2015-09-01
- Inventor: Harumi Nishiyama , Hiroshi Onodera , Masaki Adachi , Toshinori Abe
- Applicant: Harumi Nishiyama , Hiroshi Onodera , Masaki Adachi , Toshinori Abe
- Applicant Address: JP Kanagawa
- Assignee: AMADA COMPANY, LIMITED
- Current Assignee: AMADA COMPANY, LIMITED
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2010-238424 20101025
- International Application: PCT/JP2011/074301 WO 20111021
- International Announcement: WO2012/057025 WO 20120503
- Main IPC: B23K26/10
- IPC: B23K26/10 ; B23K37/04 ; B23K26/02 ; B23K26/08 ; B23K26/38 ; B23K37/02 ; B23K37/053

Abstract:
A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done.
Public/Granted literature
- US20130193125A1 LASER PROCESSING MACHINE AND LASER PROCESSING METHOD Public/Granted day:2013-08-01
Information query
IPC分类: