Invention Grant
- Patent Title: Methods of manufacturing large-area sputtering targets
- Patent Title (中): 制造大面积溅射靶的方法
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Application No.: US13628088Application Date: 2012-09-27
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Publication No.: US09120183B2Publication Date: 2015-09-01
- Inventor: William Loewenthal , Steven Alfred Miller
- Applicant: H.C. Starck, Inc.
- Applicant Address: US MA Newton
- Assignee: H.C. Starck Inc.
- Current Assignee: H.C. Starck Inc.
- Current Assignee Address: US MA Newton
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: C23C14/34
- IPC: C23C14/34 ; B23K31/02 ; B05D1/02 ; C23C24/04
Abstract:
In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Public/Granted literature
- US20130081943A1 METHODS OF MANUFACTUING LARGE-AREA SPUTTERING TARGETS Public/Granted day:2013-04-04
Information query
IPC分类:
