Invention Grant
- Patent Title: Co-extruded microchannel heat pipes
- Patent Title (中): 共挤出微通道热管
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Application No.: US13308514Application Date: 2011-11-30
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Publication No.: US09120190B2Publication Date: 2015-09-01
- Inventor: David Eric Schwartz , Ranjeet Balakrishna Rao
- Applicant: David Eric Schwartz , Ranjeet Balakrishna Rao
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Bever, Hoffman & Harms, LLP
- Main IPC: B23P6/00
- IPC: B23P6/00 ; B23P15/26 ; H01L23/427 ; F28F21/06 ; F28F21/08 ; F28D15/02

Abstract:
A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
Public/Granted literature
- US20130133201A1 Co-Extruded Microchannel Heat Pipes Public/Granted day:2013-05-30
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