Invention Grant
US09120200B2 Polishing slurry including zirconia particles and a method of using the polishing slurry
有权
包括氧化锆颗粒的抛光浆料和使用抛光浆料的方法
- Patent Title: Polishing slurry including zirconia particles and a method of using the polishing slurry
- Patent Title (中): 包括氧化锆颗粒的抛光浆料和使用抛光浆料的方法
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Application No.: US13338753Application Date: 2011-12-28
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Publication No.: US09120200B2Publication Date: 2015-09-01
- Inventor: Andrew G. Haerle , Jun Wang , Frederic Wiss
- Applicant: Andrew G. Haerle , Jun Wang , Frederic Wiss
- Applicant Address: US MA Worcester
- Assignee: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
- Current Assignee: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
- Current Assignee Address: US MA Worcester
- Agency: Abel Law Group, LLP
- Agent Adam Keser
- Main IPC: B24B37/04
- IPC: B24B37/04 ; C09G1/02 ; H01L21/304
Abstract:
A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.
Public/Granted literature
- US20120171936A1 POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY Public/Granted day:2012-07-05
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