Invention Grant
- Patent Title: Methods of RTM molding
- Patent Title (中): RTM成型方法
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Application No.: US13834534Application Date: 2013-03-15
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Publication No.: US09120253B2Publication Date: 2015-09-01
- Inventor: Toshihide Sekido , Kazuaki Kitaoka , Hiroshi Odani , Shigeru Nishiyama , Masahiko Shimizu
- Applicant: Toray Industries, Inc. , Mitsubishi Heavy Industries, Ltd.
- Applicant Address: JP JP
- Assignee: Toray Industries, Inc.,Mitsubishi Heavy Industries, Ltd.
- Current Assignee: Toray Industries, Inc.,Mitsubishi Heavy Industries, Ltd.
- Current Assignee Address: JP JP
- Agency: DLA Piper LLP (US)
- Priority: JP2002-295932 20021009; JP2002-295933 20021009; JP2002-295934 20021009; JP2002-312454 20021028
- Main IPC: B29C70/44
- IPC: B29C70/44 ; B29C45/00 ; B29C70/54 ; B29C70/68
Abstract:
A method of RTM molding including laminating a plurality of reinforcing fiber materials in a mold to form a reinforcing fiber material laminate, and impregnating a resin into said reinforcing fiber material laminate by injecting a resin in a direction from an end surface of said reinforcing fiber material laminate along a laminate surface while reducing pressure in said mold by evacuation.
Public/Granted literature
- US20130207293A1 METHODS OF RTM MOLDING Public/Granted day:2013-08-15
Information query
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