Invention Grant
- Patent Title: Injection molding method and injection molding machine
- Patent Title (中): 注塑成型法和注塑机
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Application No.: US14051181Application Date: 2013-10-10
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Publication No.: US09120256B2Publication Date: 2015-09-01
- Inventor: Masakazu Hiraishi , Takashi Nakagawa , Akira Yabe
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2013-003026 20130111
- Main IPC: B29C45/14
- IPC: B29C45/14
Abstract:
After a first die and a second die are opened, a base film of a film is separated from the first die so as to tilt the surface of the film with respect to a parting face of the first die.
Public/Granted literature
- US20140197570A1 INJECTION MOLDING METHOD AND INJECTION MOLDING MACHINE Public/Granted day:2014-07-17
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