Invention Grant
US09120683B2 Method and device using a ceramic bond material for bonding metallic interconnect to ceramic electrode
有权
使用陶瓷接合材料的方法和装置,用于将金属互连件接合到陶瓷电极
- Patent Title: Method and device using a ceramic bond material for bonding metallic interconnect to ceramic electrode
- Patent Title (中): 使用陶瓷接合材料的方法和装置,用于将金属互连件接合到陶瓷电极
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Application No.: US13577327Application Date: 2010-02-08
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Publication No.: US09120683B2Publication Date: 2015-09-01
- Inventor: Jean Yamanis , Dustin Frame , Lei Chen , Ellen Y. Sun
- Applicant: Jean Yamanis , Dustin Frame , Lei Chen , Ellen Y. Sun
- Applicant Address: CA Burnaby
- Assignee: Ballard Power Systems Inc.
- Current Assignee: Ballard Power Systems Inc.
- Current Assignee Address: CA Burnaby
- Agency: Seed IP Law Group PLLC
- International Application: PCT/US2010/023448 WO 20100208
- International Announcement: WO2011/096939 WO 20110811
- Main IPC: H01M8/02
- IPC: H01M8/02 ; C01G51/00 ; H01M4/86 ; H01M8/12 ; G01N27/407 ; H01M4/88

Abstract:
An electrochemical device includes a ceramic electrode, a metallic interconnect, and a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together. The ceramic material includes manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect.
Public/Granted literature
- US20120295183A1 METHOD AND DEVICE USING A CERAMIC BOND MATERIAL FOR BONDING METALLIC INTERCONNECT TO CERAMIC ELECTRODE Public/Granted day:2012-11-22
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