Invention Grant
US09120683B2 Method and device using a ceramic bond material for bonding metallic interconnect to ceramic electrode 有权
使用陶瓷接合材料的方法和装置,用于将金属互连件接合到陶瓷电极

Method and device using a ceramic bond material for bonding metallic interconnect to ceramic electrode
Abstract:
An electrochemical device includes a ceramic electrode, a metallic interconnect, and a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together. The ceramic material includes manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect.
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