Invention Grant
US09120726B2 Radiation-sensitive resin composition, compound and producing method of compound
有权
辐射敏感性树脂组合物，化合物及其制备方法
- Patent Title: Radiation-sensitive resin composition, compound and producing method of compound
- Patent Title (中): 辐射敏感性树脂组合物，化合物及其制备方法
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Application No.: US13525563Application Date: 2012-06-18
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Publication No.: US09120726B2Publication Date: 2015-09-01
- Inventor: Ken Maruyama
- Applicant: Ken Maruyama
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-294433 20091225
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07C309/75 ; G03F7/039
Abstract:
A radiation-sensitive resin composition includes a compound shown by a following general formula (A), a solvent and a resin having an acid-labile group. Each of R1 and R2 independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 25 carbon atoms. Each of X and Z independently represents a substituted or unsubstituted divalent hydrocarbon group having 1 to 25 carbon atoms. Y represents a single bond or the like. n represents an integer from 0 to 5.
Public/Granted literature
- US20120258399A1 RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND PRODUCING METHOD OF COMPOUND Public/Granted day:2012-10-11
Information query
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