Invention Grant
- Patent Title: Curable compositions
- Patent Title (中): 可固化组合物
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Application No.: US14356806Application Date: 2012-11-09
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Publication No.: US09120926B2Publication Date: 2015-09-01
- Inventor: Radhakrishnan Karunakaran , Nikhil E. Verghese
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2012/064470 WO 20121109
- International Announcement: WO2013/071122 WO 20130516
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L71/02 ; C08L53/00
Abstract:
Curable compositions including an epoxy resin, a hardener, and a block copolymer having a thermoset-philic block and a thermoset-phobic block, where the block copolymer is from 20 weight percent to 80 weight percent of the curable composition are described herein.
Public/Granted literature
- US20140343234A1 CURABLE COMPOSITIONS Public/Granted day:2014-11-20
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