Invention Grant
- Patent Title: NanoLayer Deposition process for composite films
- Patent Title (中): 复合膜的纳米层沉积工艺
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Application No.: US13235909Application Date: 2011-09-19
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Publication No.: US09121098B2Publication Date: 2015-09-01
- Inventor: Robert Anthony Ditizio , Tue Nguyen , Tai Dung Nguyen
- Applicant: Robert Anthony Ditizio , Tue Nguyen , Tai Dung Nguyen
- Applicant Address: NL
- Assignee: ASM International N.V.
- Current Assignee: ASM International N.V.
- Current Assignee Address: NL
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H05H1/00
- IPC: H05H1/00 ; C23C16/56 ; C23C16/40 ; C23C16/455

Abstract:
A NanoLayer Deposition (NLD) process for depositing composite films of tertiary, quaternary, pentanary, and hexary stoichiometric films is provided. The inventive deposition process is a cyclic process consisting of a sequence of thin film deposition and treatment steps to obtain a desired film stoichiometry. The deposition steps are not self-limiting as in atomic layer deposition. In one embodiment for depositing a compound oxide film, the deposition process comprises a first deposition, followed by a hydrogen-containing plasma treatment, a second deposition followed by a hydrogen-containing plasma treatment, and then a third deposition followed by a hydrogen-containing plasma and then an oxygen-containing plasma treatment to produce a stoichiometric quaternary film. The cyclic process is repeated until the desired overall film thickness is achieved. The inventive process is used to fabricate high k dielectric films, ferroelectric films, piezoelectric films, and other complex oxides.
Public/Granted literature
- US20120021138A1 NANOLAYER DEPOSITION PROCESS FOR COMPOSITE FILMS Public/Granted day:2012-01-26
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