Invention Grant
- Patent Title: Method for waterproofing substrate
- Patent Title (中): 防水基材的方法
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Application No.: US13765205Application Date: 2013-02-12
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Publication No.: US09121142B2Publication Date: 2015-09-01
- Inventor: Noriyoshi Yano , Satoru Yoshida
- Applicant: DYFLEX CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DYFLEX CORPORATION
- Current Assignee: DYFLEX CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2010-181301 20100813
- Main IPC: E01C11/16
- IPC: E01C11/16 ; E01D19/08 ; E01C3/06 ; E01C7/32 ; E01C11/00

Abstract:
A method for waterproofing a substrate, the method including adhering an adhesive member obtained by using an active hydrogen-containing synthetic resin, to a urethane-based waterproof layer to laminate a pavement adhesive layer; applying or spraying an isocyanate group-containing compound onto the pavement adhesive layer; and paving an asphalt mixture on the surface of the pavement adhesive layer.
Public/Granted literature
- US20140050525A1 METHOD FOR WATERPROOFING SUBSTRATE Public/Granted day:2014-02-20
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