An apparatus for de-embedding through substrate vias is provided. The apparatus may include pads on a first side of a substrate are coupled to through vias extending through a substrate, wherein pairs of the through vias are interconnected by transmission lines of varying lengths along a second side of the substrate. The apparatus may further include pairs of pads coupled together by transmission lines of the same varying lengths. Apparatuses may include through vias surrounding a through via device under test. The surrounding through vias are connected to the through via device under test by a backside metal layer. The apparatus may further include a dummy structure having an area equal to an area of the backside metal layer.