Invention Grant
- Patent Title: Wafer level lens, lens sheet and manufacturing method thereof
- Patent Title (中): 晶片级透镜，透镜片及其制造方法
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Application No.: US14036485Application Date: 2013-09-25
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Publication No.: US09121973B2Publication Date: 2015-09-01
- Inventor: Yun-Lien Hsiao , Shu-Hao Hsu , Wei-Hsin Lin , Shih-Wei Yeh , Jen-Hui Lai
- Applicant: HIMAX TECHNOLOGIES LIMITED
- Applicant Address: TW Tainan
- Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee Address: TW Tainan
- Agency: J.C. Patents
- Main IPC: B29D11/00
- IPC: B29D11/00 ; G02B7/02 ; G02B3/00 ; G02B13/00
Abstract:
A method of manufacturing a lens sheet including following steps is provided. A first structure is provided. The first structure includes a first transparent substrate and a first lens film attached to the first transparent substrate. A second structure is provided. The second structure includes a second transparent substrate and a second lens film. The second transparent substrate has a first surface and a second surface opposite to the first surface. The second lens film is attached to the first surface. The first lens film is attached to the second lens film. A third lens film is formed on the second surface of the second substrate after the first lens film is attached to the second lens film. Moreover, a lens sheet and a wafer level lens are also provided.
Public/Granted literature
- US20140098433A1 WAFER LEVEL LENS, LENS SHEET AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-04-10
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