Invention Grant
- Patent Title: Optical connector package and optical connector
- Patent Title (中): 光连接器封装和光连接器
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Application No.: US13555173Application Date: 2012-07-22
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Publication No.: US09122029B2Publication Date: 2015-09-01
- Inventor: Kai-Wen Wu
- Applicant: Kai-Wen Wu
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101110703A 20120328
- Main IPC: G02B6/255
- IPC: G02B6/255 ; G02B6/42

Abstract:
An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.
Public/Granted literature
- US20130259432A1 OPTICAL CONNECTOR PACKAGE AND OPTICAL CONNECTOR Public/Granted day:2013-10-03
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