Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US13475622Application Date: 2012-05-18
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Publication No.: US09122114B2Publication Date: 2015-09-01
- Inventor: Youngsuk Song , Seungjin Choi , Seongyeol Yoo
- Applicant: Youngsuk Song , Seungjin Choi , Seongyeol Yoo
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201110132769 20110520
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G02F1/1362 ; H01L27/12 ; G02F1/1335 ; G02F1/1368 ; G02F1/1343

Abstract:
An embodiment of the disclosed technology provides a method of manufacturing an array substrate, including: a first mask process of forming an inorganic material protrusion on a base substrate; a second mask process of forming a reflective region pattern, a gate line, a gate electrode branched from the gate line, and a common electrode; a third mask process of forming an active island and a data line formed and forming a source electrode connected to the data line and a drain electrode on the active island and a channel; a fourth mask process of forming an insulation material layer, treating the insulation material layer to form a planarization layer, and forming a through hole above the drain electrode; and a fifth mask process of forming a pixel electrode and connected to the drain electrode via the through hole in a reflective region.
Public/Granted literature
- US20120292625A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-11-22
Information query
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