Invention Grant
- Patent Title: Integrated circuit apparatus, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler, with configuration taking account of heat
- Patent Title (中): 集成电路设备，三维集成电路，三维处理器设备和处理调度器，配置考虑热量
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Application No.: US13996160Application Date: 2012-10-22
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Publication No.: US09122286B2Publication Date: 2015-09-01
- Inventor: Takashi Morimoto , Kouji Kai
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-263913 20111201; JP2011-263919 20111201; JP2011-263921 20111201
- International Application: PCT/JP2012/006744 WO 20121022
- International Announcement: WO2013/080426 WO 20130606
- Main IPC: G11C7/04
- IPC: G11C7/04 ; G05F5/00 ; H01L25/065 ; G06F12/08 ; H01L27/02 ; H01L27/105 ; H01L27/11 ; G06F15/80 ; H01L23/34 ; H01L23/00 ; H01L25/18
Abstract:
The present invention provides a three-dimensional integrated circuit wherein generation of hot spot which makes a high temperature part as a result of intensively generated heat can be suppressed in. The integrated circuit apparatus comprises: a first circuit made of a memory circuit, a second circuit made of an arithmetic circuit, and a control circuit. The first circuit is partitioned into a plurality of circuit blocks according to the distance from the arranged position of the second circuit, and the control circuit controls the partitioned respective circuit blocks separately.
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