A conductive electrode structure includes a substrate layer; at least one adhesion layer formed on the substrate layer for forming a circuit pattern; a conductive electrode layer formed on the adhesion layer for forming a conducting circuit corresponding to the circuit pattern; a first blackened layer formed on the conductive electrode layer corresponding to the circuit pattern and manufactured with an easily etched material; and a weatherproof layer formed on the first blackened layer and manufactured with an etch-resistant material. The weatherproof layer has a thickness smaller than the first blackened layer. The first blackened layer has a dark color for absorbing and stopping light from entering into the conductive electrode layer, and accordingly forms a shielding surface that prevents the conductive electrode layer from being directly visually perceived by a user. The conductive electrode structure also avoids side etching of the conductive electrode layer to ensure increased yield rate.