Invention Grant
- Patent Title: Hinge module and electronic device
- Patent Title (中): 铰链模块和电子设备
-
Application No.: US13938224Application Date: 2013-07-09
-
Publication No.: US09122454B2Publication Date: 2015-09-01
- Inventor: Hsien-Wei Chen , Cheng-Nan Ling , Yi-Ta Huang
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW102114643A 20130424
- Main IPC: E05F1/08
- IPC: E05F1/08 ; G06F1/16

Abstract:
A hinge module connected between a first body and a second body of an electronic device is provided. The hinge module includes a hinge connecting the first and the second bodies, a linking rod, and a sleeve pivoted to the second body. The linking rod has a first end connected to the first body and a second end slidably coupled into the sleeve. When the first and the second bodies are rotated by the hinge module, the first body drives the linking rod such that the second end slides in the sleeve and drives the sleeve to rotate relative to the second body. Inner wall of the sleeve has at least one interfering section. When the second end moves onto the interfering section, the linking rod is interfered to the sleeve, such that the first body is supported by the hinge module and opened relative to the second body.
Public/Granted literature
- US20140317882A1 HINGE MODULE AND ELECTRONIC DEVICE Public/Granted day:2014-10-30
Information query