Invention Grant
- Patent Title: Methods for firmware signature
- Patent Title (中): 固件签名方法
-
Application No.: US14286106Application Date: 2014-05-23
-
Publication No.: US09122876B2Publication Date: 2015-09-01
- Inventor: Brian A. Batke , Jack M. Visoky , James J. Kay , Scott A. Mintz , William B. Cook
- Applicant: Rockwell Automation Technologies, Inc.
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H04L9/32
- IPC: H04L9/32 ; G06F21/57 ; G06F21/44 ; G06F9/445 ; G06F9/44
Abstract:
A method for installing embedded firmware is provided. The method includes generating one or more firmware file instances and generating one or more digital certificate instances that are separate instances from the firmware file instances. The method includes associating the one or more digital certificate instances with the one or more firmware file instances to facilitate updating signature-unaware modules with signature-aware firmware or to facilitate updating signature-aware modules with signature-unaware firmware.
Public/Granted literature
- US20140331038A1 METHODS FOR FIRMWARE SIGNATURE Public/Granted day:2014-11-06
Information query
