Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US14084361Application Date: 2013-11-19
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Publication No.: US09123465B2Publication Date: 2015-09-01
- Inventor: Yosuke Moriyama
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2011-149902 20110706
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/255 ; H01F17/00 ; H01F17/04 ; H01F27/29

Abstract:
A laminated body is formed by stacking insulating layers to be formed into a rectangular parallelepiped shape. A linear conductor is stacked together with the insulating layers and connects end surfaces of the laminated body that are opposed to each other with respect to a first direction. Lengths of the end surfaces of the laminated body in a second direction, which is perpendicular to the stacking direction and the first direction, are equal to or smaller than the lengths of the end surfaces in the stacking direction.
Public/Granted literature
- US20140070912A1 ELECTRONIC COMPONENT Public/Granted day:2014-03-13
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