Invention Grant
- Patent Title: Method for fabricating solid electrolytic capacitors
- Patent Title (中): 固体电解电容器的制造方法
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Application No.: US13803064Application Date: 2013-03-14
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Publication No.: US09123468B2Publication Date: 2015-09-01
- Inventor: Ching-Feng Lin , Ming-Tsung Chen , Shu-Yu Lin
- Applicant: APAQ TECHNOLOGY CO., LTD.
- Applicant Address: TW Miaoli County
- Assignee: APAQ TECHNOLOGY CO., LTD.
- Current Assignee: APAQ TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Miaoli County
- Agency: Lai & Cai Intellectual Property (USA) Office
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/042 ; H01G9/045 ; H01G9/052 ; H01G9/15

Abstract:
The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.
Public/Granted literature
- US20140259580A1 METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS Public/Granted day:2014-09-18
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